Dynaloy™, LLC • 6445 Olivia Lane • Indianapolis, Indiana 46226 • USA Tel 317-788-5694 • Fax 317-788-5690 • www.dynaloy.com • firstname.lastname@example.org EPOXY REMOVAL SOLVENT GUIDE Page 2 of 2 DIRECTIONS FOR USE: Dynasolve™ 165: 1.
SOLVENT DESCRIPTIONS Dynasolve 100 Dimethylformamide-based. Not selective. Dynasolve 150 Dynasolve 165 Dynasolve 180 Dynasolve 185 Dynasolve 1 85 SG Dynasolve 190 Dynasolve 200 Dynasolve 210 Flammable.
Disclaimer Other Information 16 Prepared By Lauri Kirby, Technical Support Issue Date 29-Mar-2004 Material Name DYNASOLVE CU-6 Print Date 29-Mar-2004 4 / 4 ...
Dynasolve 165: Dynasolve 165 is effective at removal of most room temp erature and heat cured epoxies, including amine cured. It will disintegrate most epoxies at room temperature, but ...
... EPOXIES Dynasolve 165 X X X X X X X Methylene chloride based Dynasolve 185 X X X X X X X X Removes amine-cured epoxies Dynasolve 2000 X X X X X X X Removes anhydride-cured epoxies Dynasolve 750/ 711 X X X X X X X X 711 is aluminum-safe Dynasolve M-35 X Removes most uncured polymers To Remove: ...
The glass spheres are finally released from the silicon substrate using Dynasolve 165. EXPERIMENTAL RESULTS Fabrication Results Material wear during batch-mode *USM for stainless-steel spheres made of SS440 and SS316 were compared for determining the most suitable tool material for this application.
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